From Base Stations to Test Equipment: A Complete Analysis of Application Scenarios for RF Resistors

Challenges:

• 5G base station RF front-ends need to handle tens to hundreds of watts of transmit power

• In massive MIMO antenna arrays, signal distribution networks split power across multiple channels

• Reflected power from each channel, if not effectively absorbed, can feed back into the power amplifier module

• Consequence: PA performance degrades, and in severe cases, devices may burn out

SHINHOM's Solution:

• Flange Mount Terminations

• Typical model: RFR50N-800CT93401A

• Power handling: up to 800W

• VSWR as low as 1.20:1 (DC to 1.2GHz)

• Efficiently absorbs reflected power to protect the PA module

• Flange structure with AlN substrate ensures rapid heat conduction for stable operation at high power

Scenario 2: Test and Measurement Equipment – Attenuators Enable Precise Signal Control

Challenges:

• Spectrum analysers, signal generators, and network analysers rely on precise signal attenuation

• Attenuators must provide stable attenuation across the entire operating frequency band

• Low VSWR and good flatness must be maintained

• Front-end must handle high-power signals from the device under test

• Signal must pass without distortion

• Temperature changes may affect attenuation accuracy

SHINHOM's Solution:

• Chip Attenuator Series (CA-A, CA-C packages)

• Standard attenuation value: 30dB, tolerance ±1dB

• Temperature coefficient: ±150ppm/°C, stable across full temperature range

• Operating temperature range: -55°C to +150°C

• Chip package supports SMT placement, suitable for high-density PCB designs

• AlN substrate + thin-film process

• VSWR as low as 1.20:1 (DC to 3GHz)

• Stable insertion loss with excellent harmonic suppression performance

Challenges:

• Isolators at the PA output prevent reflected power from feeding back

• The third port of the isolator requires a high-power termination to absorb reflected energy

• Insufficient power capacity or poor heat dissipation in the termination can cause isolator failure

• Consequence: PA module damage

SHINHOM's Solution:

• Flange Mount Termination Series (TX-A, TX-B packages)

• Typical model: RFR50N-500CT2732A

• Power handling: 500W

• VSWR better than 1.30:1 (DC to 2.5GHz)

• Flange mount structure for direct attachment to heatsink surface

• AlN substrate with high thermal conductivity (170-200W/m·K)

• Heat is quickly conducted to the cooling system, preventing hot spot accumulation